Gamers Nexus’ Steve recently got a chance to get hands-on with a demolished AMD Ryzen 7000 desktop CPU.
AMD Ryzen 7000 CPU Removal Reveals Gold-Plated IHS & Zen 4 CCD With Quality TIM
Removed CPUs are part of the Ryzen 9 family. It has two dies and we know that the two CCD configurations are only applicable to the Ryzen 9 7950X and Ryzen 9 7900X. The chip has a total of three dies, two of which are AMD Zen 4 CCDs manufactured on the aforementioned 5nm process node, with IODs around the middle and a larger die based on the 6nm process node. The AMD Ryzen 7000 CCD will feature a total of 6.57 billion transistors, measured at a die size of 70mm2 compared to Zen 3’s 83mm2, a 58% increase over the Zen 3 CCD which has 415 million transistors. increase.
Given Intel’s CPUs, the few SMDs (capacitors/resistors) scattered around the package are usually under the package substrate. We had to design a new kind of IHS in-house called the Octopus. You can see the final production chip!
That being said, IHS is an interesting component for AMD Ryzen 7000 Desktop CPUs. One photo shows his eight-arm arrangement, which Robert Hallock ‘AMD’s Technical Director of Marketing’ calls ‘Octopus’. Under each arm is a small application of his TIM used to solder the IHS to the interposer. Each arm sits right next to a huge array of capacitors, making it very difficult to remove the chip. Also, each arm is raised slightly to make room for the SMDs, so users don’t have to worry about heat being trapped underneath.
AMD Ryzen 7000 Desktop CPU Removed (Image credit: GamersNexus):
Der8auer has given a statement to Gamers Nexus about the upcoming deli kits for the in-development AMD Ryzen 7000 desktop CPUs, and has also apparently explained why the new CPUs will feature gold-plated CCDs.
As for the gold coating, there is the aspect that indium and gold can be soldered without flux. This simplifies the process and eliminates the need to use harsh chemicals on your CPU. Without the gold coating, you could theoretically solder silicon to copper, but that would be more difficult and would require flux to break down the oxide layer.
From Der8auer to GamersNexus
The most interesting area of the AMD Ryzen 7000 Desktop CPU IHS other than ARM is the gold plated IHS which is used to increase heat dissipation from the CPU/IO die directly to the IHS. Two 5nm Zen 4 CCDs and one 6nm IO die with liquid metal TIM or thermal interface material for better thermal conductivity. The aforementioned gold plating helps a lot with heat dissipation. I don’t know yet if the capacitor will have a silicone coating, but looking at the previous package shot it looks like it does.
The IHS’s smaller surface area is also reported to mean better compatibility with existing coolers with round and square cold plates. A square cold plate is the preferred choice, but a round one will work just fine. Noctua also points to his TIM application method, suggesting users to use the single dot pattern in the middle of his IHS on AMD AM5 CPUs.
AMD Ryzen 7000 Desktop CPU Renderings (with/without IHS):
Another thing that needs to be pointed out is that each Zen 4 CCD is very close to the edge of the IHS. This was not always the case with previous Zen CPUs. So not only is it very difficult to delid, but the core is mostly his IO die, so we have to prepare a cooling device to accommodate such chips. AMD Ryzen 7000 Desktop CPUs will launch in Fall 2022 on the AM5 platform. This is a chip that can reach up to 5.85GHz with a package power of up to 230W, making every little bit of cooling a must for overclockers and enthusiasts.
AMD Mainstream Desktop CPU Generation Comparison:
|AMD CPU family||code name||processor process||Processor cores/threads (max)||TDP (maximum)||platform||platform chipset||memory support||PCIe support||release|
|Raizen 1000||summit ridge||14nm (Zen 1)||8/16||95W||AM4||300 series||DDR4-2677||generation 3.0||2017|
|Risen 2000||Pinnacle Ridge||12nm (Zen+)||8/16||105W||AM4||400 series||DDR4-2933||generation 3.0||2018|
|Raisen 3000||Matisse||7nm (Zen 2)||16/32||105W||AM4||500 series||DDR4-3200||Generation 4.0||2019|
|Risen 5000||Vermeer||7nm (Zen 3)||16/32||105W||AM4||500 series||DDR4-3200||Generation 4.0||2020|
|Ryzen 5000 3D||Warhol?||7nm (Zen 3D)||8/16||105W||AM4||500 series||DDR4-3200||Generation 4.0||2022|
|Raizen 7000||Raphael||5nm (Zen 4)||16/32||170W||AM5||600 series||DDR5-5200||Generation 5.0||2022|
|Ryzen 7000 3D||Raphael||5nm (Zen 4)||16/32?||105-170W||AM5||600 series||DDR5-5200/5600?||Generation 5.0||2023|
|Raisen 8000||granite ridge||3nm (Zen5)?||to be decided||to be decided||AM5||700 series?||DDR5-5600+||Generation 5.0||2024-2025?|